Effect of bonding interface on delamination behavior of drawn Cu/Al bar clad material
SangmokLEE,Min-GeunLEE,Sang-PillLEE,Geun-AhnLEE,Yong-BaeKIM,Jong-SupLEE,Dong-SuBAE
Transactions of Nonferrous Metals Society of China ›› 2012, Vol. 22 ›› Issue (Special 3) : 645-649.
Effect of bonding interface on delamination behavior of drawn Cu/Al bar clad material
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